Laser - Hochratebohren von 10 µm dicker Metallfolie mit 2D Polygonscanner

Video thumbnail (Frame 0) Video thumbnail (Frame 250) Video thumbnail (Frame 311) Video thumbnail (Frame 425) Video thumbnail (Frame 486) Video thumbnail (Frame 550) Video thumbnail (Frame 625) Video thumbnail (Frame 683) Video thumbnail (Frame 734) Video thumbnail (Frame 797)
Video in TIB AV-Portal: Laser - Hochratebohren von 10 µm dicker Metallfolie mit 2D Polygonscanner

Formal Metadata

Title
Laser - Hochratebohren von 10 µm dicker Metallfolie mit 2D Polygonscanner
Alternative Title
High speed Laser drilling of 10 µm metal foil using a 2D Polygon scanning system
Author
Contributors
License
CC Attribution - NonCommercial 3.0 Germany:
You are free to use, adapt and copy, distribute and transmit the work or content in adapted or unchanged form for any legal and non-commercial purpose as long as the work is attributed to the author in the manner specified by the author or licensor.
Identifiers
Publisher
Release Date
2014
Language
Original sound, no spoken text
Producer
Weinhold, Sebastian
Production Place
Labor 6 - Laserinstitut Hochschule Mittweida

Content Metadata

Subject Area
Abstract
Laser - Hochratebohren von 10 µm dicker Metallfolie mit 2D Polygonscanner (Scangeschwindigkeit: 250 m/s; 125.000 Löcher)
High speed Laser drilling of 10 µm metal foil using a 2D Polygon scanning system
Keywords Perforation Metallfolie polygon Hochratebearbeitung Polygonscanner Mittweida Laserinstitut LHM Laser Scanner material Processing polygon scanning system metal foil drilling Laser manufacturing High speed
Meeting/Interview
Computer animation
Computer animation
Experiment indoor
Loading...
Feedback
hidden