Laser - Hochratebearbeitung mit 2D Polygonscanner an Siliziumwafern

Video in TIB AV-Portal: Laser - Hochratebearbeitung mit 2D Polygonscanner an Siliziumwafern

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Formal Metadata

Title
Laser - Hochratebearbeitung mit 2D Polygonscanner an Siliziumwafern
Alternative Title
High speed Laser structuring of Silicon wafer material using a 2D Polygon scanning system
Author
Weinhold, Sebastian
Streek, Andre
Contributors
Streek, Andre
License
CC Attribution - NonCommercial 3.0 Germany:
You are free to use, adapt and copy, distribute and transmit the work or content in adapted or unchanged form for any legal and non-commercial purpose as long as the work is attributed to the author in the manner specified by the author or licensor.
Identifiers
Publisher
Laserinstitut Hochschule Mittweida
Release Date
2014
Language
Silent film
Producer
Weinhold, Sebastian
Production Place
Labor 6 - Laserinstitut Hochschule Mittweida

Content Metadata

Subject Area
Abstract
Laser - Hochratebearbeitung mit 2D Polygonscanner an Siliziumwafern (Scangeschwindigkeit: 200 m/s)
High speed Laser structuring of Silicon wafer material using a 2D Polygon scanning system
Keywords
Silizium
Scanner
Polygon
Hochratebearbeitung
Mittweida
Laserinstitut
LHM
Laser
Laser manufacturing
High Speed
Polygonscanner
polygon scanning system
Siliziumwafer
Silicon wafer
Silicon
Material Processing
Computer animation
Computer animation
Computer animation
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Timings

  415 ms - page object

Version

AV-Portal 3.13.0 (5c8e2efe74178fb46921415ac72371299d2e6b01)
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