Laser - Hochratebearbeitung mit 2D Polygonscanner an Siliziumwafern

Video in TIB AV-Portal: Laser - Hochratebearbeitung mit 2D Polygonscanner an Siliziumwafern

Formal Metadata

Title
Laser - Hochratebearbeitung mit 2D Polygonscanner an Siliziumwafern
Alternative Title
High speed Laser structuring of Silicon wafer material using a 2D Polygon scanning system
Author
Weinhold, Sebastian
Streek, Andre
Contributors
Streek, Andre
License
CC Attribution - NonCommercial 3.0 Germany:
You are free to use, adapt and copy, distribute and transmit the work or content in adapted or unchanged form for any legal and non-commercial purpose as long as the work is attributed to the author in the manner specified by the author or licensor.
Identifiers
Publisher
Release Date
2014
Language
Silent film
Producer
Weinhold, Sebastian
Production Place
Labor 6 - Laserinstitut Hochschule Mittweida

Content Metadata

Subject Area
Abstract
Laser - Hochratebearbeitung mit 2D Polygonscanner an Siliziumwafern (Scangeschwindigkeit: 200 m/s)
High speed Laser structuring of Silicon wafer material using a 2D Polygon scanning system
Keywords Silizium Scanner Polygon Hochratebearbeitung Mittweida Laserinstitut LHM Laser Laser manufacturing High Speed Polygonscanner polygon scanning system Siliziumwafer Silicon wafer Silicon Material Processing
Pattern (sewing) Laser
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Timings

   59 ms - page object

Version

AV-Portal 3.21.3 (19e43a18c8aa08bcbdf3e35b975c18acb737c630)
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